The Summit 1800i is the latest in the popular Summit series. Carrying forward the leading heating capacity, throughput, repeatability, and reliability of the Summit 1800, the Summit 1800i offers a 2.2 kW Top heater boost and optimized processes for connectors, sockets, and multi-BGA rework.
HumiSeal launched synthetic rubber 1B59 LU, an enhanced version of the popular 1B51 NSLU. It has improved temperature resistance up to 150ºC and extremely low moisture vapor permeability. Its excellent flexibility enables low stress on components. The 1B59 LU is fully compliant with the RoHS Directive 2011/65/EC.
Kester NXG33 is a lead-free, no-clean and halogen-free solder paste with state-of-the-art capabilities to support modern electronics assembly challenges. Kester NXG33 is fully capable of printing and reflowing 01005 components, even in air reflow, with minimal graping behavior. NXG33 can handle a wide variety of printer variables, including print speed, long idle times and a wide range of temperature and humidity. Post-soldering, the NXG33 offers minimized defects, including headin- pillow and QFN/BGA voiding. This paste meets the IPC definition for halogen-free and is classified as type ROL0 per IPC J-STD-004B. Kester NXG33 is available in Type 4 powder with the SAC305 alloy.
• Halogen-free per IPC definition
• Capable of 01005 print and reflow, even in air reflow environment
• Can print down to 8 mil x 8 mil apertures
• Designed specifically for fine feature printing with T4 powder
• Low QFN/BGA voiding
• Excellent solderability with halogen-free chemistry
• Optimized flux residues to mitigate head-inpillow defects
• Capable of print speeds up to 6 in/sec (150 mm/sec)
• Low slump behavior minimizes defects
• ICT probeable residues
• Reflowable in air or nitrogen
You can find any others Lead Free Solder Paste in the Kester website: www.kester.com
Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing. EP256 has the widest possible reflow processing window. EP256 is also capable of stencil printing downtimes of up to 90 minutes with an effective first print down to 20 mils. EP256 is a solderpaste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.
• Stable wetting behavior over a wide range of profiles
• Capable of 90 minute break times in printing
• High print speeds to 200+ mm/sec (8+ in/sec)
• Compatible with enclosed print head systems
• Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder
• High activity on all substrates, including OSPs
• Capable of off-pad printing with no solderballs after reflow
• Stencil life: 8+ hours (process dependent)
• Scrap is reduced due to less paste dry out
• Stable tack over 8+ hours
• Classified as ROL0 per J-STD-004
• Compliant to Bellcore GR-78
You can find any others Tin Lead Solder Paste in the Kester website: www.kester.com
| Soldering | Solder | Tin | Lead | LeadFree |
| Glueing | Coating | Selective | Conformal | Paste |
| Thermally conductive | Silicone | Poliuretane | Acryl | Epoxy |
| Fluxing | Flux | Alcohol based | Water based | Bar |
| Wire | UV | BGA | Rework | X-ray |